报告题目：On-Chip Calorimetry in In Situ TEM

报告人：Dr. Dan Zhou    德国莱布尼茨晶体生长研究所

报告时间：2025年5月22日 星期四 10:00

报告地点：A332

邀请人：   苏东 研究员

联系人：   刘效治 副研究员

联系电话：82649555

报告摘要：

    Time-resolved correlations between the environment, the properties, and the material structures during the reaction processes make in situ and operando electron microscopy more and more attractive in recent years. The dynamically and simultaneously visualized multimodal materials information at atomic to micro scale opens new horizon for various material process investigations, such as phase transformation, material growth, corrosion, catalytic reactions, and so on. For long time, thermal analysis was not incorporated as one part of the multimodal technique. Thermal analysis techniques, like differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), thermomechanical analysis (TMA) etc., are widely used in material community for measuring the heat transfer involved in material processes mentioned above outside TEM.

    In this presentation, I will firstly introduce the foundation of on-chip calorimetry in in situ TEM, which enables simultaneous thermal analysis with process, structure and property measurements. Then I present the application of on-chip calorimetry in calibrating operando TEM system time delays and its applications to catalytic reactions and semiconductor phase transition research. As an emerging technique, I will conclude the presentation with a brief outlook.

报告人简介：